现行

GB/T 42158-2023

微机电系统（MEMS）技术 微沟槽和棱锥式针结构的描述和测量方法
Micro-electromechanical systems technology（MEMS） —Description and measurement methods for micro trench and pyramidal needle structures

2023-03-17

现行

GB/T 34899-2017

微机电系统（MEMS）技术 基于拉曼光谱法的微结构表面应力测试方法
Micro-electromechanical system technology—Measuring method of microstructure surface stress based on Raman spectroscopy

2017-11-01

现行

GB/T 44849-2024

微机电系统（MEMS）技术 金属膜材料成形极限测量方法
Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials

2024-10-26

现行

GB/T 38446-2020

微机电系统（MEMS）技术 带状薄膜抗拉性能的试验方法
Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films

2020-03-06

现行

GB/T 34894-2017

微机电系统（MEMS）技术 基于光学干涉的MEMS微结构应变梯度测量方法
Micro-electromechanical system technology—Measuring method for strain gradient measurements of MEMS microstructures using an optical interferometer

2017-11-01

现行

GB/T 34900-2017

微机电系统（MEMS）技术 基于光学干涉的MEMS微结构残余应变测量方法
Micro-electromechanical system technology—Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer

2017-11-01

现行

GB/T 44919-2024

微机电系统(MEMS)技术　薄膜力学性能的鼓胀试验方法
Micro-electromechanical systems(MEMS) technology—Bulge test method for measuring mechanical properties of thin films

2024-11-28

现行

GB/T 38341-2019

微机电系统(MEMS)技术　MEMS器件的可靠性综合环境试验方法
Micro-electromechanical system technology—The reliability test methods of MEMS in integrated environments

2019-12-31

现行

GB/T 44842-2024

微机电系统（MEMS）技术 薄膜材料的弯曲试验方法
Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials

2024-10-26

现行

GB/T 44515-2024

微机电系统（MEMS）技术 MEMS压电薄膜机电转换特性测量方法
Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

2024-09-29

现行

GB/T 34898-2017

微机电系统（MEMS）技术 MEMS谐振敏感元件非线性振动测试方法
Micro electromechanical system technology—Test method for the nonlinear vibration of the MEMS resonant sensitive element

2017-11-01

现行

GB/T 42896-2023

微机电系统（MEMS）技术 硅基MEMS纳尺度结构冲击试验方法
Micro-electromechanical systems（MEMS） technology—Impact test method for nanostructures of silicon based MEMS

2023-08-06

现行

GB/T 38447-2020

微机电系统（MEMS）技术 MEMS结构共振疲劳试验方法
Micro-electromechanical system technology—Fatigue testing method of MEMS structure using resonant vibration

2020-03-06

现行

GB/T 42895-2023

微机电系统（MEMS）技术 硅基MEMS微结构弯曲强度试验方法
Micro-electromechanical systems（MEMS）technology—Bending strength test method for microstructures of silicon based MEMS

2023-08-06

现行

BS EN 62047-25-2016

Semiconductor devices. Micro-electromechanical devices-Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 微机电设备

2016-11-30

现行

GB/T 44513-2024

微机电系统（MEMS）技术 传感器用MEMS压电薄膜的环境试验方法
Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application

2024-09-29

现行

GB/T 42897-2023

微机电系统（MEMS）技术 硅基MEMS纳米厚度膜抗拉强度试验方法
Micro-electromechanical systems（MEMS） technology—Tensile strength test method for nano-scale membranes of silicon based MEMS

2023-08-06

现行

IEC 62047-25-2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 - 微机电器件 - 第25部分:硅基存储器制造技术 - 微接合区域的拉压和剪切强度测量方法

2016-08-29

现行

GB/T 44514-2024

微机电系统（MEMS）技术 层状MEMS材料界面黏附能四点弯曲试验方法
Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2024-09-29

现行

IEC 62047-47-2024

Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
半导体器件.微机电器件.第47部分:硅基MEMS制造技术.微结构弯曲强度的测量方法

2024-08-23