现行

BS EN 62047-4-2010

Semiconductor devices. Micro-electromechanical devices-Generic specification for MEMS
半导体器件 微机电设备

2010-11-30

现行

BS EN 62047-5-2011

Semiconductor devices. Micro-electromechanical devices-RF MEMS switches
半导体器件 微机电设备

2013-04-30

现行

GB/T 32817-2016

半导体器件 微机电器件 MEMS总规范
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS

2016-08-29

现行

IEC 62047-53-2025

Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
半导体器件微机电器件第53部分:MEMS电热传递器件

2025-10-02

现行

IEC 62047-5-2011

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
半导体器件 - 微机电器件 - 第5部分:RF MEMS开关

2011-07-13

现行

IEC 62047-4-2026

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范

2026-01-07

现行

IEC 62047-4-2026 RLV

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范

2026-01-07

现行

GB/T 42709.5-2023

半导体器件 微电子机械器件 第5部分：射频MEMS开关
Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches

2023-05-23

现行

BS IEC 62047-33-2019

Semiconductor devices. Micro-electromechanical devices-MEMS piezoresistive pressure-sensitive device
半导体器件 微机电设备

2019-04-18

现行

BS EN 62047-10-2011

Semiconductor devices. Micro-electromechanical devices-Micro-pillar compression test for MEMS materials
半导体器件 微机电设备

2011-09-30

现行

IEC 62047-33-2019

Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
半导体器件微机电器件第33部分:MEMS压阻压敏器件

2019-04-05

现行

IEC 62047-41-2021

Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
半导体器件.微机电器件.第41部分:RF MEMS环行器和隔离器

2021-06-15

现行

IEC 62047-10-2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
半导体器件 - 微机电器件 - 第10部分:MEMS材料的微柱压缩测试

2011-07-26

现行

BS IEC 62047-32-2019

Semiconductor devices. Micro-electromechanical devices-Test method for the nonlinear vibration of MEMS resonators
半导体器件 微机电设备

2019-01-29

现行

BS EN 62047-9-2011

Semiconductor devices. Micro-electromechanical devices-Wafer to wafer bonding strength measurement for MEMS
半导体器件 微机电设备

2013-01-31

现行

IEC 62047-32-2019

Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
半导体器件微机电器件第32部分:MEMS谐振器非线性振动的试验方法

2019-01-24

现行

IEC 62047-9-2011

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
半导体器件 - 微机电器件 - 第9部分:晶圆晶片接合强度测量

2011-07-13

现行

IEC 62047-52-2026

Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
半导体器件微机电器件第52部分:可拉伸MEMS的双轴拉伸试验方法

2026-03-04

现行

BS IEC 62047-34-2019

Semiconductor devices. Micro-electromechanical devices-Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件 微机电设备

2019-04-16

现行

IEC 62047-34-2019

Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件微机电器件第34部分:硅片上MEMS压阻压敏器件的试验方法

2019-04-05