现行

GB/T 44842-2024

微机电系统（MEMS）技术 薄膜材料的弯曲试验方法
Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials

2024-10-26

现行

GB/T 44839-2024

微机电系统（MEMS）技术 MEMS材料微柱压缩试验方法
Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials

2024-10-26

现行

GB/T 44514-2024

微机电系统（MEMS）技术 层状MEMS材料界面黏附能四点弯曲试验方法
Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2024-09-29

现行

GB/T 42897-2023

微机电系统（MEMS）技术 硅基MEMS纳米厚度膜抗拉强度试验方法
Micro-electromechanical systems（MEMS） technology—Tensile strength test method for nano-scale membranes of silicon based MEMS

2023-08-06

现行

GB/T 42896-2023

微机电系统（MEMS）技术 硅基MEMS纳尺度结构冲击试验方法
Micro-electromechanical systems（MEMS） technology—Impact test method for nanostructures of silicon based MEMS

2023-08-06

现行

GB/T 38341-2019

微机电系统(MEMS)技术　MEMS器件的可靠性综合环境试验方法
Micro-electromechanical system technology—The reliability test methods of MEMS in integrated environments

2019-12-31

现行

GB/T 44513-2024

微机电系统（MEMS）技术 传感器用MEMS压电薄膜的环境试验方法
Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application

2024-09-29

现行

BS EN 62047-13-2012

Semiconductor devices. Micro-electromechanical devices-Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
半导体器件 微机电设备

2012-05-31

现行

GB/T 41852-2022

半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

2022-10-12

现行

IEC 62047-47-2024

Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
半导体器件.微机电器件.第47部分:硅基MEMS制造技术.微结构弯曲强度的测量方法

2024-08-23

现行

GB/T 34898-2017

微机电系统（MEMS）技术 MEMS谐振敏感元件非线性振动测试方法
Micro electromechanical system technology—Test method for the nonlinear vibration of the MEMS resonant sensitive element

2017-11-01

现行

GB/T 38447-2020

微机电系统（MEMS）技术 MEMS结构共振疲劳试验方法
Micro-electromechanical system technology—Fatigue testing method of MEMS structure using resonant vibration

2020-03-06

现行

GB/T 44919-2024

微机电系统(MEMS)技术　薄膜力学性能的鼓胀试验方法
Micro-electromechanical systems(MEMS) technology—Bulge test method for measuring mechanical properties of thin films

2024-11-28

现行

IEC 62047-13-2012

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
半导体器件 - 微机电器件 - 第13部分:测量MEMS结构的粘合强度的弯曲和剪切型测试方法

2012-02-28

现行

GB/T 44517-2024

微机电系统（MEMS）技术 MEMS膜残余应力的晶圆曲率和悬臂梁挠度试验方法
Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films

2024-09-29

现行

BS 10/30211454 DC

BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures
英国标准EN 62047-13 半导体器件 微型机电设备 第13部分 测量MEMS结构粘接强度的弯曲和剪切试验方法

2010-02-22