现行

BS IEC 62047-40-2021

Semiconductor devices. Micro-electromechanical devices-Test methods of micro-electromechanical inertial shock switch threshold
半导体器件 微机电设备

2021-09-14

现行

BS EN 62047-20-2014

Semiconductor devices. Micro-electromechanical devices-Gyroscopes
半导体器件 微机电设备

2014-10-31

现行

IEC 62047-40-2021

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
半导体器件.微机电器件.第40部分:微机电惯性冲击开关阈值的试验方法

2021-09-03

现行

BS EN 62047-1-2016

Semiconductor devices. Micro-electromechanical devices-Terms and definitions
半导体器件 微机电设备

2016-04-30

现行

BS EN 62047-19-2013

Semiconductor devices. Micro-electromechanical devices-Electronic compasses
半导体器件 微机电设备

2013-10-31

现行

BS EN 62047-10-2011

Semiconductor devices. Micro-electromechanical devices-Micro-pillar compression test for MEMS materials
半导体器件 微机电设备

2011-09-30

现行

BS IEC 62047-35-2019

Semiconductor devices. Micro-electromechanical devices-Test method of electrical characteristics under bending deformation for flexible electromechanical devices
半导体器件 微机电设备

2021-04-20

现行

BS IEC 62047-32-2019

Semiconductor devices. Micro-electromechanical devices-Test method for the nonlinear vibration of MEMS resonators
半导体器件 微机电设备

2019-01-29

现行

BS EN 62047-2-2006

Semiconductor devices. Micro-electromechanical devices-Tensile testing method of thin film materials
半导体器件 微机电设备

2006-11-30

现行

BS EN 62047-18-2013

Semiconductor devices. Micro-electromechanical devices-Bend testing methods of thin film materials
半导体器件 微机电设备

2013-10-31

现行

BS EN 62047-4-2010

Semiconductor devices. Micro-electromechanical devices-Generic specification for MEMS
半导体器件 微机电设备

2010-11-30

现行

BS EN 62047-5-2011

Semiconductor devices. Micro-electromechanical devices-RF MEMS switches
半导体器件 微机电设备

2013-04-30

现行

IEC 62047-20-2014

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
半导体器件微机电器件第20部分:陀螺仪

2014-06-26

现行

GB/T 32817-2016

半导体器件 微机电器件 MEMS总规范
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS

2016-08-29

现行

BS EN 62047-26-2016

Semiconductor devices. Micro-electromechanical devices-Description and measurement methods for micro trench and needle structures
半导体器件 微机电设备

2016-05-31

现行

IEC 62047-43-2024

Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法

2024-03-19

现行

BS EN 62047-22-2014

Semiconductor devices. Micro-electromechanical devices-Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件 微机电设备

2014-10-31

现行

BS IEC 62047-34-2019

Semiconductor devices. Micro-electromechanical devices-Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件 微机电设备

2019-04-16

现行

BS EN 62047-15-2015

Semiconductor devices. Micro-electromechanical devices-Test method of bonding strength between PDMS and glass
半导体器件 微机电设备

2015-07-31

现行

BS EN 62047-6-2010

Semiconductor devices. Micro-electromechanical devices-Axial fatigue testing methods of thin film materials
半导体器件 微机电设备

2010-04-30