1.1 本试验方法涉及使用小规模拉伸搭接剪切样品对木材粘合剂和相关粘合剂进行粘合和测试，强调瞬态内聚强度是粘合时间和温度的函数。 1.2 使用薄被粘物可以将粘合线快速加热到高温，并在测试前在受控压力下在这些温度下保持一段时间。 1.3 在压制后和测试前，对粘合剂进行可选的快速强制空气冷却，可以评估测试温度对瞬态强度的影响。 1.4 规定粘合重叠距离是为了确保粘合线而不是被粘物条的未粘合部分发生故障，并尽量减少剪切应力对粘合带的影响- 拉伸试验期间沿重叠部分的均匀性。 1.5 标准木材或替代的非标准材料必须具有规定的高质量和均匀的结构和尺寸，以尽量减少粘合的可变性，并在测试过程中最大限度地将应力传递到粘合中。 1.6 使用该方法可以探索木材变异性和类型，或替代非木材材料的性能对粘结强度发展的影响。 1.7 在加热压制过程中，对粘合重叠部分进行可选的密封，可以评估水分对粘合的影响。 1.8 热损伤，无论是预成型粘结还是延长粘结形成时间，都可以使用本试验方法作为时间和高温的函数进行评估。 1.9 以国际单位制表示的值应被视为标准值。本标准不包括其他计量单位。 1.10 本标准并不旨在解决与其使用相关的所有安全问题（如果有的话）。本标准的使用者有责任在使用前建立适当的安全、健康和环境实践，并确定监管限制的适用性。第节给出了一些具体的危害声明 10 关于危险。 1.11 本国际标准是根据世界贸易组织技术性贸易壁垒委员会发布的《关于制定国际标准、指南和建议的原则的决定》中确立的国际公认的标准化原则制定的。 =====意义和用途====== 4.1 该测试方法能够评估在受控粘合温度、时间和压力条件下用粘合剂粘合的木材和其他材料的强度值。粘结形成和后续测试以协调的方式受到影响，这使得能够以不同的参数作为自变量来探索类似粘结类型组的瞬态强度值。这些变量中的主要变量是键形成的温度和测试前保持选定温度的时间。使用受控的粘合剂施加方法、快速达到稳定的粘合形成条件以及快速过渡到粘合测试模式，可以在粘合从有限强度（或初始粘性）发展到最大强度时获得粘合强度的快照。 衍生数据可用于评估和比较不同类型和配方的粘合剂的强度发展特征。因此，该方法可用于帮助定制和匹配粘合剂，以制造涉及加热的各种粘合产品。 4.2 该方法也可用于评估温度和时间对样品键降解的共同依赖效应。此类热降解研究可能需要高达265°C（509°F）的压制温度。将试样压制一系列时间和温度，然后在高温下或在快速强制空气冷却后立即进行测试。 或者，预成型粘结样品的热损伤可以通过在测试前对其进行受控的温度和时间序列来评估。 4.3 该方法还可用于评估木材类型和可变性或非木材材料对粘合强度发展的影响。 4.4 通过在形成过程中密封样品粘合的重叠区域，该方法还可用于评估水分和其他驻留挥发性流体对粘合强度发展的影响。 4.5 该方法还可用于评估测试不同形成的键的温度对其强度的影响。在粘合形成后但在测试前立即进行受控的快速强制空气冷却对于此类研究是必要的。 这种方法可用于探索热固性粘合剂的热塑性特性，以及热熔粘合剂的强度随压制和测试温度的变化。

1.1 This test method concerns bonding and testing of wood adhesives and related adhesives using small scale tensile lap-shear samples in a manner that emphasizes transient cohesive strength as a function of bonding time and temperature. 1.2 Use of thin adherends enables bondlines to be rapidly heated to elevated temperatures and maintained at those temperatures for a range of times at a controlled pressure before testing. 1.3 Optional rapid forced air cooling of bonds after pressing and immediately before testing enables the effect of testing temperature on transient strength to be evaluated. 1.4 Bond overlap distance is specified to ensure that failure occurs in the bondline rather than in unbonded portions of adherend strips, and also to minimize the effect of shear stress non-uniformity along the overlap during tensile testing. 1.5 Standard wood or alternative non-standard materials must be of specified high quality and uniformity of structure and dimension to minimize variability of bonding and maximize stress transfer into the bonds during testing. 1.6 The effect of wood variability and type, or of the properties of alternative non-wood materials, on bond strength development may be explored using the method. 1.7 Optional hermetic sealing of bond overlaps during their heated pressing enables the effect of moisture on bonding to be evaluated. 1.8 Thermal damage, either of pre-formed bonds or by prolonging bond forming times, may be evaluated as a function of time and elevated temperature using this test method. 1.9 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. 1.10 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. Some specific hazards statements are given in Section 10 on Hazards. 1.11 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. ====== Significance And Use ====== 4.1 The test method enables strength values for wood and other materials bonded with an adhesive under a range of controlled bonding temperature, time, and pressure conditions to be evaluated. Bond formation and subsequent testing is affected in a coordinated fashion, and this enables transient strength values of sets of similar bond types to be explored with diverse parameters as independent variables. Principal among these variables is the temperature at which bonds are formed and the time that selected temperatures are maintained prior to testing. The use of controlled methods of adhesive application, the rapid attainment of stable bond formation conditions, and the rapid transition to the bond testing mode enables snapshots of bond strength to be attained as bonds progress from limited strength (or initial tack) to maximum strength. Derived data may be used to evaluate and compare the strength development characteristics of diverse types and formulations of adhesive. The method may thus be used to aid in tailoring and matching adhesives to the manufacture of diverse bonded products that involve heating. 4.2 The method may also be used to evaluate the co-dependent effect of temperature and time on the degradation of sample bonds. Pressing temperatures up to 265 °C (509 °F) may be necessary for such investigations of thermal degradation. Specimens are pressed for a range of times and temperatures and very shortly thereafter tested either at elevated temperature or immediately following rapid forced air cooling. Alternatively, thermal damage of pre-formed bond samples may be evaluated by subjecting them to controlled temperature and time sequences prior to testing. 4.3 The method may also be used to evaluate the effect of wood type and variability, or of non-wood materials, on bond strength development. 4.4 By hermetically sealing the overlap region of sample bonds during their formation, the method may also be used to evaluate the effect of moisture and other resident volatile fluids on bond strength development. 4.5 The method may also be used to evaluate the effect that the temperature at which variously formed bonds are tested has on their strength. Controlled rapid forced air cooling immediately after bond formation but before testing is necessary for such investigations. This approach may be employed to explore the thermoplastic characteristic of thermosetting adhesives and also the strength of hot melt adhesives as a function of pressing and testing temperatures.