IEC 62047-4:20 26 RLV包含官方IEC国际标准及其红线版本。Redline版本仅提供英文版本，为您提供了一种快速简单的方法来比较IEC官方标准与其以前版本之间的所有变化。 IEC 62047-4:20 26描述了由半导体制造的微机电系统（MEMS）的通用规范，这些规范是本系列其他部分中针对各种类型的MEMS应用（如传感器、RF MEMS、光学MEMS、生物MEMS、微型TA和功率MEMS）给出的规范的基础。本文件规定了质量评估的一般程序，并建立了描述和测试电气、光学、机械和环境特性的一般原则。IEC 62047的这一部分有助于制定定义通过微机械加工技术制造的设备和系统的标准，包括但不限于材料表征和处理、组装和tes过程控制和测量方法。本文中描述的MEMS基本上由半导体材料制成。然而，本文中的陈述也适用于使用除半导体之外的材料的MEMS，例如聚合物、玻璃、金属和陶瓷材料。 与上一版相比，此版本包括以下重大技术变更: a)在范围中，包括用于各种类型MEMS应用的光学MEMS、生物MEMS、微型TAS和功率MEMS； b)表1中的MEMS类别和术语略有修改，例如在应用技术中增加了消费电子和汽车。

IEC 62047-4:2026 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 62047-4:2026 describes generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, optical MEMS, bio-MEMS, micro TAS, and power MEMS. This document specifies general procedures for quality assessment and establishes general principles for describing and testing of electrical, optical, mechanical and environmental characteristics. This part of IEC 62047 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this document are basically made of semiconductor material. However, the statements made in this document are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials.
This edition includes the following significant technical changes with respect to the previous edition:
a) in the Scope, optical MEMS, bio-MEMS, micro TAS, and power MEMS for various types of MEMS applications were included;
b) MEMS categories and terms in Table 1 were slightly modified such consumer electronics and automotive were added that in application technology.