IEC 60749-10:20 22旨在评估处于自由状态并组装到印刷线路板上用于电气设备的器件。该方法旨在确定设备和子组件承受中等严重冲击的兼容性。子组件的使用是在组装到印刷线路板上的使用条件下测试设备的一种手段。由于突然施加的力或由处理、运输或现场操作产生的运动的突然变化引起的机械冲击会干扰操作特性，特别是如果冲击脉冲是重复的。这是用于器械鉴定的破坏性试验。 本版取消并取代2002年出版的第一版。与上一版相比，此版本包括以下重大技术变更:涵盖未连接的组件和连接到印刷电路板的组件； 修改峰值加速度和脉冲持续时间的公差限值； 增加了速度变化和等效跌落高度的数学公式。

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:

1. covers both unattached components and components attached to printed wiring boards;
2. tolerance limits modified for peak acceleration and pulse duration;
3. mathematical formulae added for velocity change and equivalent drop height.