本板级跌落测试方法旨在评估和比较在加速测试环境中手持式电子产品应用的表面安装电子元件的跌落性能，其中电路板过度弯曲会导致产品故障。其目的是使测试板和测试方法标准化，以提供表面安装组件跌落测试性能的可再现性评估，同时复制产品级测试期间通常观察到的故障模式。

This Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.