IEC 60749-22-1:20 25提供了一种用于确定键合到管芯或封装键合表面上的导线和相应互连的强度和失效模式的装置，并且可以在未封装或解封装的器件上执行。该测试方法可以在由直径范围为15 μ m至76 μ m(0.0006″至0.003″)的线制成的金合金、铜合金和银合金热声(球和缝合)键合上进行；以及在由直径范围为18 μ m至600 μ m(0.000 7″至0.024″)的线制成的金合金、铜合金和铝合金超声波(楔形)键合上。 这种引线键合拉力测试方法是破坏性的。它适用于工艺开发、工艺控制或质量保证。 该测试方法允许两种不同的拉线方法: a)一种方法包括使用放置在金属丝下方然后拉动的钩子。b)一种方法要求在导线被切断后，在连接到待测键合的导线上放置一个夹子，用这个夹子来拉动导线。 该测试方法不包括使用引线键合剪切测试的键合强度测试。IEC 60749-22-2中描述了引线键合剪切测试。 该第一版与IEC 60749-22-2:20 25第一版一起取消并取代了2002年发布的IEC 60749-22第一版。 与上一版相比，此版本包括以下重大技术变更: a）重大更新，包括新技术和新材料（如铜线）的使用，涉及作为两个独立子部分的完全重写（本文件和IEC 60749-22-2）。 本国际标准将与IEC 60749-22-2:20 25结合使用。

IEC 60749-22-1:2025 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be performed on unencapsulated or decapsulated devices. This test method can be performed on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire ranging in diameter from 15 μm to 76 μm (0,000 6" to 0,003"); and on gold alloy, copper alloy, and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 μm to 600 μm (0,000 7" to 0,024").
This wire bond pull test method is destructive. It is appropriate for use in process development, process control, or quality assurance.
This test method allows for two distinct methods of pulling wires:
a) One method incorporates the use of a hook that is placed under the wire and is then pulled.
b) One method requires that after the wire be cut, a clamp is placed on the wire connected to the bond to be tested, and this clamp is used to pull the wire.
This test method does not include bond strength testing using wire bond shear testing. Wire bond shear testing is described in IEC 60749-22-2.
This first edition, together with the first edition of IEC 60749-22-2:2025, cancels and replaces the first edition of IEC 60749-22 published in 2002.
This edition includes the following significant technical changes with respect to the previous edition:
a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749-22-2).
This International Standard is to be used in conjunction with IEC 60749-22-2:2025.