IEC 60749-26:2025建立了根据组件和微电路因暴露于规定的人体模型（HBM）静电放电（ESD）而对其损坏或退化的易感性（敏感性）进行测试、评估和分类的程序。本文件的目的是建立一种测试方法，该方法将复制HBM故障，并在测试仪之间提供可靠、可重复的HBM ESD测试结果，而不考虑组件类型。可重复的数据将允许对HBM ESD灵敏度水平进行准确的分类和比较。半导体器件的ESD测试选自本测试方法、机器型号（MM）测试方法（见IEC 60749？27）或IEC 60749系列中的其他ESD测试方法。除非另有说明，否则本试验方法为所选方法。与上一版相比，此版本包括以下重大技术变更: a)增加了新的定义； b)增加了文本，以澄清“低寄生”的指定和由此产生的津贴。新的名称包括可以通过测试程序的器件的最大引脚数。

IEC 60749-26:2025 establishes the procedure for testing, evaluating, and classifying components and microcircuits in accordance with their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose of this document is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749？27) or other ESD test methods in the IEC 60749 series. Unless otherwise specified, this test method is the one selected.
This edition includes the following significant technical changes with respect to the previous edition:
a) new definitions have been added;
b) text has been added to clarify the designation of and allowances resulting from “low parasitics”. The new designation includes the maximum number of pins of a device that can pass the test procedure.