BS IEC 62951-4:2019规定了材料弯曲疲劳性能的评估方法 用于柔性半导体器件的导电薄膜和柔性衬底。 所述膜包括沉积或粘合到非导电柔性衬底上的任何膜，例如 作为金属薄膜、透明导电电极和硅薄膜用于柔性电极 半导体器件。衬底上薄膜的电学和力学行为 进行评估。疲劳试验方法包括动态弯曲疲劳试验和静态疲劳试验 弯曲疲劳试验。交叉引用:IEC 62047-2:2006IEC 62047-22:2014IEC 62047-12:2011IEC 62715-1-1:2013IEC 62951-1购买本文件时提供的所有现行修订版均包含在购买本文件中。

BS IEC 62951-4:2019 specifies an evaluation method of the bending fatigue properties of conductive thin film and flexible substrate for the application at flexible semiconductor devices. The films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film used for flexible semiconductor devices. The electrical and mechanical behaviours of films on the substrate are evaluated. The fatigue test methods include dynamic bending fatigue test and static bending fatigue test.Cross References:IEC 62047-2:2006IEC 62047-22:2014IEC 62047-12:2011IEC 62715-1-1:2013IEC 62951-1All current amendments available at time of purchase are included with the purchase of this document.