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BS IEC 62951-5:2019
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Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for thermal characteristics of flexible materials
半导体器件 柔性可伸缩半导体器件
BS IEC 62951-5:2019规定了挠性电缆热特性的试验方法
材料。本文件包括可以使用的术语、定义、符号和测试方法
用于评估和确定实际使用的柔性材料的热特性。
该测量方法依赖于基于
与温度有关的光学反射率。本文件适用于基板和基板
可弯曲和拉伸的薄膜柔性半导体材料。购买本文件时可获得的所有当前修订均包含在购买本文件中。
BS IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible
materials. This document includes terms, definitions, symbols, and test methods that can be
used to evaluate and determine thermal characteristics of flexible materials for practical use.
The measurement method relies on non-contact optical thermometry that is based on
temperature dependent optical reflectance. This document is applicable to both substrate and
thin-film flexible semiconductor materials that are subjected to bending and stretching.All current amendments available at time of purchase are included with the purchase of this document.