IEC 62951-4:2019规定了用于柔性半导体器件的导电薄膜和柔性基板弯曲疲劳性能的评估方法。所述膜包括沉积或接合到非导电柔性衬底上的任何膜，例如用于柔性半导体器件的金属薄膜、透明导电电极和硅薄膜。评估了基底上薄膜的电气和机械性能。疲劳试验方法包括动态弯曲疲劳试验和静态弯曲疲劳试验。

IEC 62951-4:2019 specifies an evaluation method of the bending fatigue properties of conductive thin film and flexible substrate for the application at flexible semiconductor devices. The films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film used for flexible semiconductor devices. The electrical and mechanical behaviours of films on the substrate are evaluated. The fatigue test methods include dynamic bending fatigue test and static bending fatigue test.